Enclosure design

Enclosure Design

Enclosure Design Capabilities

• Custom Enclosure Engineering:

Tailored enclosures for electronics, IoT devices, industrial systems, and consumer products. Designs optimized for durability, aesthetics, manufacturability, and functionality.

• Thermal & Structural Analysis:

Advanced thermal management solutions with heat dissipation modeling, airflow analysis, and structural reinforcement to ensure reliability in demanding environments.

• Material Expertise:

Skilled in using plastics (ABS, Polycarbonate, Nylon), sheet metals (aluminum, stainless steel), composites, and die-cast alloys, balancing cost, strength, and performance.

• Manufacturing-Ready Designs:

Designs optimized for injection molding, 3D printing, sheet-metal fabrication, and CNC machining. We ensure seamless transition from prototype to mass production.

• Ergonomics & Aesthetics:

Human-centered design approach to ensure user comfort, product appeal, and brand consistency, while maintaining mechanical integrity.

Key Technical Capabilities

• 3D CAD Modeling & Simulation:

High-precision 3D modeling using SolidWorks, Fusion 360, and Creo. Includes stress testing, thermal simulation, and mechanical validation.

• Tolerance & Fit Optimization:

Design practices that ensure precise fits, snap features, seals, and fastening mechanisms for both rugged and consumer-friendly products.

• EMI/EMC Shielding Integration:

Incorporating shielding solutions, grounding paths, and conductive coatings to protect sensitive electronics from interference.

• IP & Safety Compliance:

Designs tailored to meet IP (Ingress Protection) ratings, UL, CE, and other industry standards for dustproofing, waterproofing, and safety.

• Rapid Prototyping Support:

End-to-end support from digital design to functional prototypes using 3D printing, CNC, and low-volume molding for quick validation.