Enclosure Design
Enclosure Design Capabilities
Tailored enclosures for electronics, IoT devices, industrial systems, and consumer products. Designs optimized for durability, aesthetics, manufacturability, and functionality.
Advanced thermal management solutions with heat dissipation modeling, airflow analysis, and structural reinforcement to ensure reliability in demanding environments.
Skilled in using plastics (ABS, Polycarbonate, Nylon), sheet metals (aluminum, stainless steel), composites, and die-cast alloys, balancing cost, strength, and performance.
Designs optimized for injection molding, 3D printing, sheet-metal fabrication, and CNC machining. We ensure seamless transition from prototype to mass production.
Human-centered design approach to ensure user comfort, product appeal, and brand consistency, while maintaining mechanical integrity.
Key Technical Capabilities
High-precision 3D modeling using SolidWorks, Fusion 360, and Creo. Includes stress testing, thermal simulation, and mechanical validation.
Design practices that ensure precise fits, snap features, seals, and fastening mechanisms for both rugged and consumer-friendly products.
Incorporating shielding solutions, grounding paths, and conductive coatings to protect sensitive electronics from interference.
Designs tailored to meet IP (Ingress Protection) ratings, UL, CE, and other industry standards for dustproofing, waterproofing, and safety.
End-to-end support from digital design to functional prototypes using 3D printing, CNC, and low-volume molding for quick validation.
